Telecom Lead @ Mobile World Congress 2013: Qualcomm has made several key announcements in Barcelona.
Qualcomm Technologies, in association with Sierra Wireless and Ericsson, has demonstrated LTE carrier aggregation and Category 4 data rates.
LTE carrier aggregation enables LTE Category 4 downlink throughput speeds of up to 150Mbps for operators without 20MHz of continuous spectrum. The demonstration is powered by Qualcomm Gobi 4G LTE MDM9225 chipset, Sierra Wireless’ AirCard mobile hotspot and Ericsson network infrastructure.
The Qualcomm Gobi MDM9x25 chipset, manufactured using a 28nm process, also is the first in the industry to support 3GPP Release 10 multicarrier HSPA+ and LTE Advanced.
The Qualcomm Gobi MDM9625 and MDM9225 chipsets began sampling to vendors last November and are anticipated to enable commercial device launches with LTE Advanced Carrier Aggregation later this year.
READ Mobile World Congress 2013 HERE
Meanwhile, Qualcomm Technologies and Deutsche Telekom announced that an Internet of Everything (IoE) development platform, based on Qualcomm Technologies’ Gobi QSC6270-Turbo chipset, will be made available by Deutsche Telekom to application developers in Europe and worldwide.
With support for Oracle Java ME Embedded 3.2 available, this IoE development platform is intended to target developers looking to create the next generation of machine-to-machine (M2M) and IoE applications.
Deutsche Telekom plans to start shipping these development platforms from the second quarter of 2013.
Deutsche Telekom will utilize the IoE development platform to help accelerate innovation amongst its M2M Developer Community in its quest to enable end-to-end M2M solutions.
In yet another announcement, Qualcomm Innovation Center said it would extend the AllJoyn software development project with new core interoperable services to enable richer experiences for consumers.
The AllJoyn framework will include new services designed to address fundamental use cases to enable a truly useful Internet of Everything. Today, the AllJoyn SDK provides the core building blocks developers need to address discoverability, connectivity, security and management of dynamic, ad-hoc networks between nearby devices.
These new core services will be upstreamed into the AllJoyn open source project by May 2013. It is expected that many Qualcomm Technologies platforms and products will include integrated support for these services as well.
Qualcomm Technologies also announced the industry’s first 4G LTE Advanced embedded data connectivity platform for mobile computing devices, including thin form factor laptops, tablets and convertibles.
The technology, based on Qualcomm Technologies’ Gobi chipsets — the MDM9225 and MDM9625 — is the first embedded, mobile computing solution to support LTE carrier aggregation and LTE Category 4 with peak data rates of up to 150Mbps.
Qualcomm Gobi MDM9x25 chipsets began sampling to module vendors last November and will enable commercial device launches in the second half of this calendar year.
Meanwhile, Qualcomm Technologies will be the first company to produce working silicon on TSMC’s 28nm HPM (High Performance Mobile) process technology.
TSMC’s 28HPM is the first production process that can support 2GHz + application processors with low power consumption. The process is ideally suited for tablet and high-end smartphone applications.