Huawei to showcase LTE TDD multi-mode chipset at GSMA mobile asia congress


Huawei will showcase the world’s first multi-mode terminal chip solution based
on 3GPP R9 at the 2011 GSMA Mobile Asia Congress in Hong Kong.



Huawei’s multi-mode solution is a new milestone and indicates the convergence
of LTE TDD/FDD. It will accelerate realization of global LTE TDD/FDD roaming
services.



The key product in this multi-mode solution “Balong 710” is the
baseband processor chip Hi6920, which is the industry’s first chip with the
ability of supporting LTE R9. At present, all chips in telecoms industry can
only support 3GPP R8.



Huawei’s Hi6920 supports LTE TDD/FDD/TD-SCDMA/UMTS/GSM/EDGE/GPRS multi modes.
Based on the dual-layer Beamforming and MIMO, Hi6920 will bring operators
better experience with highest downlink data speed of up to150Mb/s.



Beside Balong710, Huawei will showcase other multi-mode terminal devices
including mobile WiFi device E598.



In 2010, Huawei unveiled the world’s first LTE TDD 4×4 MIMO technology with
downlink data speed of up to 260Mb/s. In June 2011, Huawei demonstrated the
world’s first LTE TDD/FDD roaming at the NGMN(Next Generation Mobile Network)
Congress.



In July 2011, Huawei launched the world’s first WiMAX/LTE TDD dual mode 40MHz
RRU at the GTI round-table conference and the global WiMAX/LTE TDD Development
Forum in North America. In August 2011, Huawei and Aircel to have jointly
conducted the world’s first GSM/UMTS/LTE TDD trial on the existing network in
India.



By Telecomlead.com Team
[email protected]