Sequans and Nationz team up on dual-mode TD-SCDMA/LTE devices for China

Telecom Lead Asia-Pacific: 4G chipmaker Sequans
Communications has entered into a partnership with Nationz Technologies, a
Chinese provider of RF chips and wireless communications solutions and
products.

 

Under the partnership, both companies are working
together to develop TD-SCDMA/LTE solutions and products for LTE bands 7, 38, 39 and 40, specifically for the Chinese
marketplace.

 

The collaboration will yield unique multi-band,
multi-mode devices of several types, including mobile routers, CPE, and USB
dongles. Initial products will become available at around mid-year.

 

Nationz is known for their design excellence in China
and our collaboration with them is yielding valuable devices for Chinese
consumers who will benefit greatly from dual-mode TD-SCDMA/LTE solutions,” said
Georges Karam, Sequans CEO.

 

Sequans’ LTE semiconductor solutions support global LTE
networks, both TDD and FDD, and are delivered with comprehensive software and
reference designs for multiple device types for a truly universal solution.

 

Sequans’ chips represent the latest and the most
advanced in LTE baseband semiconductor technology. Combined with Nationz’s RF
and TD-SCDMA solutions, our products offer great value that will facilitate a
seamless transition for Chinese consumers into the next generation of
wireless,” said Bin Zhang, VP of Nationz.

 

Sequans offers Mont Blanc, which is a LTE platform
optimized for the design of host-less USB modems, CPE, and mobile routers or
hotspots. The company also offers Andromeda, optimized for handsets and
tablets. Sequans’ LTE chips are compact and powerful, delivering category 4
throughput of up to 150 Mbps in a very small 10×10 mm package that includes
SDRAM.

 

Gemtek and Seowon Intech adopt Sequans’ second-generation LTE
semiconductor technology

 

Recently,
Sequans Communications 
announced that Gemtek, a
provider of broadband wireless solutions, built a new LTE USB modem based on
Sequans’ new generation LTE technology.

 

LTE connectivity in the device is powered by Sequans’
SQN3120 LTE baseband chip and SQN3140 companion RF chip.

 

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