Telecom Chips

Intel technology for 5G

Intel in talks to buy GlobalFoundries for $30 bn

Intel is in talks to buy semiconductor manufacturer GlobalFoundries for about $30 billion, Wall Street Journal reported. Any deal talks don’t appear to include GlobalFoundries...
TSMC for iPhones

TSMC eyes expansion in U.S., Japan to meet chip demand

Taiwan Semiconductor Manufacturing Co (TSMC) has signalled plans to build new factories in the United States and Japan to meet surge in demand for...
MediaTek at MWC 2019

MediaTek to educate retailers and consumers on chipset technologies

MediaTek, the world’s 4th largest fabless semiconductor company, announced an innovative drive to educate retailers and consumers around the latest chipset technologies. MediaTek will educate consumers...
Qualcomm for mobile chips

Qualcomm appoints Don McGuire as chief marketing officer

Qualcomm announced the appointment of Don McGuire as senior vice president and chief marketing officer (CMO). Don McGuire will be reporting to Cristiano Amon, president...
SK Hynix chip investment in NAND

SK Hynix starts production of DRAM with 10-nm process technology

SK Hynix, the world’s second-largest memory chip producer, has started the production of DRAM with the latest 10-nanometer (nm) process technology. SK Hynix said its...
China semiconductor industry

MKS to buy Atotech for $5.1 bn to expand chip manufacturing

Semiconductor equipment maker MKS Instruments will buy specialty chemicals group Atotech for about $5.1 billion to expand its chip manufacturing offerings. The deal comes at...
Texas Instruments HQ

Micron sells Lehi, Utah, fab to Texas Instruments for $1.5 bn

Micron Technology announced its deal to sell its Lehi, Utah, fab to Texas Instruments – for $1.5 billion. The transaction to sell the semiconductor manufacturing...
NXP chip for automotive market

Jio to use NXP’s Layerscape processors for O-RAN small cell

NXP Semiconductors announced a partnership with Jio Platforms, a subsidiary of RIL, to deploy a 5G NR O-RAN small cell solution that incorporates NXP’s...
MediaTek 5G Dimensity 1200

MediaTek reveals Dimensity 5G Open Resource Architecture

MediaTek today announced the Dimensity 5G Open Resource Architecture that provides flexibility to smartphone makers to customize key 5G mobile device features to address...
Qualcomm 5G Modem Optimized for IIoT

Qualcomm at Mobile World Congress (MWC) 2021

Qualcomm Technologies made several important announcements at the Mobile World Congress (MWC) 2021. Qualcomm’s Snapdragon 888 Plus 5G Mobile Platform, announced at MWC 2021, is...
GlobalFoundries facebook

GlobalFoundries to build $4 bn fabrication plant in Singapore

U.S.-headquartered semiconductor manufacturer GlobalFoundries will build a new fabrication plant in Singapore to meet the global demand for chips. The semiconductor shortage will persist through...
Intel Agilex FPGA

Intel powers Deutsche Telekom, Dish Wireless and Jio networks

Intel today revealed that mobile operators such as Deutsche Telekom, Dish Wireless and Reliance Jio are transforming networks -- relying on Intel technology. Reliance Jio,...

Qualcomm, MediaTek grab share in smartphone AP market

The global smartphone applications processor (AP) market posted a double-digit shipment and revenue growth in Q1 2021, according to Strategy Analytics report. The smartphone AP...

GlobalFoundries seeks ruling in $2.5 bn damage dispute with IBM

Semiconductor manufacturer GlobalFoundries has sued International Business Machines (IBM), asking a judge to rule that it did not violate a contract with the U.S....
Infineon chipset

Infineon leads automotive semiconductor business – beating NXP

Infineon has become the leading supplier of automotive semiconductors, displacing rival NXP from the number one spot in 2020, Strategy Analytics report said. Infineon, NXP,...
Broadcom chipset

Broadcom revenue jumps 15% to $6.6 bn in second quarter

Broadcom revealed its revenue rose 15 percent to $6.61 billion in the second quarter ended May 2, from $5.74 billion a year earlier. The US-based...



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