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TI’s Bluetooth v4.0-based CC2560 and CC2564 wireless devices are available in QFN packages

Telecom Lead America: Texas Instruments announced that its Bluetooth v4.0-based CC2560 and CC2564 wireless devices are available in QFN packages offered by TI and...

Qualcomm leads mobile device GPU market with 27% share in H1 of 2012

Telecom Lead America: Wireless chip major Qualcomm is leading mobile device GPU suppliers market in the first half of 2012. Qualcomm has 26.7 percent market...

Shipments of wireless connectivity combo ICs to surpass 2 billion units by 2017

Telecom Lead Asia: Shipments of Wireless Connectivity Combo ICs are expected to surpass 2 billion units by 2017. IC vendors such as Broadcom, Qualcomm, TI,...

Texas Instruments launches quad-channel XAUI/10GBASE-KR transceiver

Telecom Lead India: Texas Instruments announced the availability of quad-channel XAUI/10GBASE-KR transceiver. The industry’s first quad-channel XAUI/10GBASE-KR transceiver is aimed at supporting multiple 10G/40G Ethernet...

Samsung Electronics leads mobile DRAM market with 61% share in second quarter

Telecom Lead America: Samsung Electronics is leading the mobile DRAM market in the second quarter. The Korean consumer electronics giant, with sales of $1.1 billion,...

Qualcomm Ventures invests in Deck App Technologies

Telecom Lead India: Deck App Technologies, Bangalore, will receive $100,000 in venture financing from Qualcomm to expand its business. The company was selected based on...

ZTE selects DSP Group’s chipset for developing home gateway with HD

Telecom Lead America: ZTE has selected DSP Group's CAT-iq 2.0 DECT chipset solutions for developing home gateway (HGW) featuring HD voice capabilities. ZTE's new triple-play...

Intel CEO Paul Otellini: excited about Intel-based tablets coming to market this year

Telecom Lead India: Paul Otellini, CEO of Intel, the world’s largest chip maker, is excited about the range of Intel-based tablets coming to market...
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Qualcomm leads global mobile handset IC market with 26% share

Telecom Lead America: Qualcomm is leading the global mobile handset IC market with 26 percent share in 2011. The market for mobile handset IC, including...

Broadcom announces a joint development agreement with Hyundai to power connected car

Telecom Lead America: Broadcom announced a joint development agreement with Hyundai Motor to power the connected car. The collaboration will integrate infotainment, telematics and Advanced...

Ciena launches new software capabilities for packet networking portfolio

Telecom Lead America: Ciena has launched new software capabilities for its packet networking portfolio. Indian telecom operators will benefit as the new software capabilities enable...
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AVM taps Altair Semiconductor to power new LTE products

Telecom Lead America: Germany based AVM has selected Altair Semiconductor to power its new LTE 4G products. The new products will support home networking and...

DSP Group and SoftAtHome integrate home security, control and automation solutions

Telecom Lead America: Chip major DSP Group and SoftAtHome have jointly integrated Digital Enhanced Cordless Technology (DECT) Ultra Low Energy (ULE) home security, control...

DSP Group signs Comigo to launch home automation solution

Telecom Lead America: DSP Group has signed up with Comigo to launch home automation (HA) solution based on DECT Ultra Low Energy (ULE) technology. The...

Broadcom likely to lead Bluetooth IC market this year

Telecom Lead America: Broadcom is likely to lead the Bluetooth IC market (including stand alone and combo ICs) market this year. Broadcom had over 40...
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Intel yet to make impact in smartphone applications processor market, Qualcomm leads

Telecom Lead India: Intel could not make any impact in global smartphone applications processor market in the first half of 2012. In H1 of 2012,...

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