Qualcomm launches two new Snapdragon S4 mobile processors
Telecom Lead America: Chip major Qualcomm has launched two new Snapdragon S4 mobile processors.
Snapdragon S4 Play processors will offer OEMs both dual-core and quad-core CPUs...
ON Semiconductor launches new system-on-chip (SoC) solution for noise reduction
Telecom Lead America: ON Semiconductor has launched a new system-on-chip (SoC) solution that helps in noise reduction.
The new SoC solution provides wideband single- or...
Standards-based wireless connectivity chipset market to exceed $10 billion in 2012
Telecom Lead America: The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, says Peter Cooney, wireless connectivity...
Microsoft and RIM in pact to give access to exFAT for Blackberry devices
Telecom Lead U.S: Microsoft and RIM have formed an agreement that gives RIM broad access to the latest Extended File Allocation Table (exFAT) for...
Samsung starts production of advanced mobile DRAM chips for mobile devices
Telecom Lead Asia: Samsung Electronics has kicked off mass production of advanced mobile DRAM (dynamic random access memory) chip.
The 2GB, low power double-data-rate 3...
Intel CTO shares new technologies for demanding telecom world
Telecom Lead America: Intel Chief Technology Officer Justin Rattner has demonstrated a working all-digital WiFi radio at the Intel Developer Forum.
“In the future, if...
Vitesse Semiconductor to expand in India to tap mobile broadband market
Telecom Lead India: Vitesse Semiconductor, a provider of IC solutions for Carrier and Enterprise networks, is expanding in india.
WPI Group, a subsidiary of WPG...
Teradata second quarter revenue up 14 percent to $665 million
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Telecom Lead America: Teradata Corporation has
reported 14 percent increase in revenue to $665 million for the
quarter...
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