Microchip unveils integrated RF module for Wi-Fi applications

By
Telecom Lead Team:
Microchip Technology has launched its integrated RF
front-end module for WLAN IEEE 802.11b/g/n and Bluetooth systems.


The
SST12LF03 device features a transmitter power amplifier, a receiver low-noise amplifier
(LNA) and a low-loss antenna switch in one integrated, compact package.


The
device’s RF ports are impedance-matched to 50 Ohms, and the module requires
only two external components to achieve optimum performance. It offers a high
linear-transmission power of 19 dBm at 3 percent EVM, using 802.11g OFDM at 54
Mbps, and 22 dBm for IEEE 802.11b operation.


The
company claims that the device supports Wi-Fi and Bluetooth Tx/Rx, and enables
simultaneous Wi-Fi and Bluetooth operation. The SST12LF03 is suitable for
embedded applications in which small size and high performance are required,
such as notebooks or other portable-electronic devices.


By
integrating three RF functions into one compact, simple-to-use package, this
front-end module makes designing easier and reduces board size. The device
features a Bluetooth port, which allows simultaneous 802.11b/g/n WLAN and
Bluetooth operation, with optimum performance for both.


With
the addition of the SST12LF03, Microchip now provides the same reliable power-amplifier
performance, combined with a LNA that features bypass mode and a low-loss
antenna switch, in a very compact package. This highly integrated module is
easy to use, with all of the RF matching circuitry included in the package.
This high level of integration simplifies board design and extends the range of
wireless systems,” said Daniel Chow, vice president of Microchip’s
Radio Frequency Division.


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