4G chipmaker Sequans @ Mobile World Congress 2013

Telecom Lead @ Mobile World Congress 2013: 4G chipmaker Sequans Communications has completed interoperability testing of Alcatel-Lucent’s LTE equipment with Sequans’ eMBMS-capable LTE chipsets (LTE Broadcast).

LTE Broadcast enables mobile operators to significantly reduce the cost of delivering high-bandwidth content to multiple users at one time over LTE networks.

Moreover, LTE Broadcast enables operators to provide new services such as video/audio coverage of live events and data offloading (for example, to push software updates).

Sequans’ current LTE platforms support eMBMS as defined in 3GPP, including the enhancements specified for LTE-Advanced.

Sequans eMBMS technology supports multiple concurrent sessions for multicast traffic along with unicast traffic on both TDD and FDD networks.

Sequans provides support for architectures combining LTE and Wi-Fi, and a standardized interface to third party eMBMS middleware.

READ Mobile World Congress 2013 HERE

Meanwhile, Sequans Communications also announced that its first LTE-Advanced chip will be sampling next quarter.

The SQN3220 is part of Sequans’ Cassiopeia platform, supporting 3GPP Release 10 specifications. Cassiopeia is Sequans’ third generation LTE platform solution, following earlier Release 8 and Release 9 solutions introduced in 2010 and 2011, respectively.

Cassiopeia supports other Release 10 enhancements such as new MIMO schemes, enhanced inter-cell interference coordination (eICIC) schemes for heterogeneous networks (HetNet), and improvements to eMBMS (evolved multimedia broadcast multicast service) or LTE Broadcast.

Sequans eMBMS technology supports multiple concurrent sessions for multicast traffic along with unicast traffic, on both TDD and FDD networks, and also provides a standardized interface to third party eMBMS middleware.

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