Agilent and Notre Dame University’s Wireless Institute to start MIMO research

Telecom Lead India: Agilent Technologies and Notre Dame University’s Wireless Institute will start research to develop multiple-input, multiple-output (MIMO) wireless technologies.

MIMO technologies involve multiple antenna systems as well as signal-processing techniques. Agilent and researchers at the Wireless Institute have established a core test facility with real-time, broadband signal generation and channel emulation for MIMO wireless systems with up to four transmitter antennas and four receiver antennas.

“We are extremely grateful for Agilent’s generous donation of a 4×4 MIMO channel emulation system,” said Thomas Pratt, research associate professor in the Wireless Institute and the Department of Electrical Engineering.

The equipment will impact the depth of applied research in wireless communications, remote sensing and radar. The instrumentation will give students access to experimental resources to enable training and scientific investigation.

Moreover, the facility will offer RF and baseband channel emulation for performance validation as well as interference and co-existence testing. The test bed can validate designs under real-world conditions with the broadest range of test parameters.

Researchers will be able to model signal propagation environments with fully parameterized, real-time emulation of multipath fading. These capabilities will accelerate the research thrusts at Notre Dame’s Wireless Institute and, ultimately, help deliver more robust wireless solutions for society.

“Agilent is delighted to support the Wireless Institute at Notre Dame and their faculty’s research into advanced wireless communications technology,” said Andy Botka, general manager and vice president of Agilent’s Microwave and Communications Division.

Recently, Agilent Technologies unveiled a redriver modeling solution to solve the challenge posed by signal distortion in multigigabit-per-second systems.

The redriver modeling solution, available in the Advanced Design System 2012 Transient Convolution Element and SystemVue 2012 AMI Modeling Kit, is used to design electrical redrivers into high-speed chip-to-chip digital links.

[email protected]