Giantec switches to Cadence, gains 30% productivity with Virtuoso Flow

Cadence Design Systems, a global electronic design
innovation company, announced that Giantec Semiconductor has adopted the
Cadence Virtuoso unified custom/analog (IC6.1) and Encounter unified digital
flows for production of its mixed-signal chips.

Giantec recently deployed the Cadence
technology to design and tape out a memory product for a low-power
micro-controller used in its smart cards, intelligent energy meters and
consumer products.

The company realized a 30 percent productivity boost in
developing its mixed-signal design by using the Cadence Virtuoso unified
custom/analog flow.

“The complexity of today’s mixed-signal chips
requires a unified approach to design implementation and verification, and
Cadence has been working closely with its customers and partners to deliver
end-to-end flows for Silicon Realization,” said Qi Wang, group director,
Solutions Marketing at Cadence.

“We continue to see proof points that this approach
is critical for success with complex mixed-signal designs, such as the
high-performance memory product from Giantec,” Wang added.

Giantec’s selection of the Cadence unified Virtuoso and
Encounter flows for this high-performance design underscores the unique
technology and business advantage that comes from using a holistic and
integrated EDA flow to meet critical time-to-market and power/performance
targets of complex silicon designs.

“Cadence R&D worked closely with us to address
our unique needs, and were able to achieve up to 30 percent productivity
improvement by using the Cadence Virtuoso technology,” said Leo Li, deputy
general manager of design at Giantec.

“Deploying Cadence technologies brought us a more
complete solution for our mixed-signal designs and a significantly higher level
of productivity,” added Li.

The Cadence approach to mixed-signal designs leverages a
unified methodology in which early design planning, front-end design,
functional verification, physical implementation, and packaging are shared
responsibilities between analog and digital teams.

This top-down approach can boost productivity of the
combined custom/analog and digital engineering team, help management hit
aggressive market windows, and increase profitability.

By Team
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