Tektronix Test Solution lends support to Intel and the PCI Express (PCIe) ecosystem

Telecom Lead America: Tektronix has provided support to
Intel and the PCI Express (PCIe) ecosystem in the testing and verification
of the new Intel XeonProcessor E5-2600 family (formerly known as Romley).

 

The Intel Xeon Processor E5-2600 family is the industry’s
first server processor with integrated PCIe 3.0, reducing I/O latency by as
much as 30 percent and improving I/O bandwidth by as much as 2x.

 

“From the very early stages, Tektronix played an
active role supporting the testing and verification of the new Intel Xeon
Processor E5-2600 family platform, bringing both test instrumentation and
expertise. This early work means that we can now offer designers products
utilizing the Intel Xeon Processor E5-2600 family a full suite of PCIe 3.0
solutions that provide unparalleled visibility from the PHY to the protocol
layers,” said Roy Siegel, general manager, Oscilloscopes, Tektronix.

 

Among the Tektronix products used to support the
development of the Integrated I/O capability were the DPO/DSA/MSO70000 Series
oscilloscopes, TLA7SA16 and TLA7SA08 Logic Protocol Analyzer modules and
TLA7000 Series Logic Analyzers, and BERTScope bit error rate testers.

 

“Support from the test and measurement community is
vital for any new platform, and with PCIe 3.0, it is even more critical as this
new technology greatly improves I/O performance and scalability,” said Jim
Pappas, director of technology initiatives, Intel Corporation.

 

The Intel development team selected Tektronix as the
protocol test vendor for early silicon verification of Intel Xeon Processor
E5-2600 family I/O performance., which led to in-depth support for verification
that is now publicly available for OEM/ODM use.

 

DPO/DSA/MSO70000 Series oscilloscopes deliver the
performance and signal fidelity required to meet PCIe 3.0 test challenges.

 

Recently, Tektronix introduced a new comprehensive protocol test platform that allows
engineers to analyze, stimulate, stress and characterize high-speed serial
links, with support for speeds up to 10Gb/s. 

 

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