Amkor Technology unveiled plans to invest a staggering $2 billion in establishing a cutting-edge semiconductor packaging and testing facility in Peoria, Arizona.
This facility will primarily focus on packaging and testing chips for Apple, with production originating from the nearby TSMC facility.
Amkor, a provider of advanced packaging and testing services for semiconductors catering to high-performance computing, automotive, and communications sectors, highlighted Apple’s pivotal role as its inaugural and primary client upon the facility’s launch.
The tech giant Apple echoed Amkor’s statement, confirming its pioneering involvement as the principal customer utilizing the services of the forthcoming manufacturing and packaging center developed by Amkor. Apple emphasized its commitment to advancing American manufacturing, aiming to push the boundaries of innovation within the United States.
Jeff Williams, Apple’s Chief Operating Officer, expressed the company’s dedication to domestic manufacturing: “Apple is committed to the future of American manufacturing, and we’ll continue to expand our investment here in the United States. Apple silicon has unlocked new levels of performance for our users, enabling them to do things they could never do before, and we are thrilled that Apple silicon will soon be produced and packaged in Arizona.”
This collaboration marks a culmination of over a decade-long partnership between Apple and Amkor, known for packaging chips extensively used in various Apple products. The project is expected to generate employment opportunities for over 2,000 individuals upon completion.
Apple’s strategic investments in advanced manufacturing are aligned with the company’s overarching commitment made in 2021 to infuse $430 billion into the U.S. economy over a five-year period.