Intel has chosen a location close to Wrocław, Poland, as the site for a semiconductor assembly and test facility.
Intel plans to invest around $4.6 billion in this facility, which will have the capability to expand in the future. It is expected that approximately 2,000 Intel employees will be supported by this facility, and the construction process will generate several thousand more jobs, including positions with suppliers.

Immediate actions such as design and planning for the facility will commence, pending approval from the European Commission. By combining Intel’s planned investments in Poland, along with its existing wafer fabrication facility in Leixlip, Ireland, and the upcoming wafer fabrication facility in Magdeburg, Germany, the company aims to establish a complete semiconductor manufacturing value chain in Europe.

Intel’s CEO, Pat Gelsinger, expressed enthusiasm about the decision, stating, “Poland already hosts Intel operations and is strategically positioned to collaborate with Intel sites in Germany and Ireland. It offers cost competitiveness compared to other global manufacturing locations and possesses a talented workforce that we are excited to contribute to its growth.”

Mateusz Morawiecki, the Prime Minister of Poland, also shared his excitement about the development, stating, “Chips and semiconductors are pivotal technologies in the 21st century, and we are thrilled to enhance Poland’s role in the global semiconductor supply chain, thereby establishing the country as an economic trendsetter.”