Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading chipmaker, is emerging as the frontrunner in advanced chip packaging patents, surpassing its competitors Samsung Electronics and Intel, according to data from LexisNexis.
Advanced chip packaging technology is a critical component that maximizes the performance of cutting-edge chip designs, making it a crucial factor for chip contract manufacturers seeking a competitive edge in the market.
The recently released data from LexisNexis reveals that TSMC and Samsung have consistently invested in advanced packaging technology over the years, while Intel’s filings have failed to keep up with the pace, Reuters news report said.
With an impressive 2,946 advanced packaging patents, TSMC not only holds the largest quantity of patents but also boasts the highest quality. Quality is measured by the number of times patents are cited by other companies, indicating their relevance and influence within the industry.
Samsung Electronics, securing the second position in both quantity and quality, holds 2,404 advanced packaging patents, according to LexisNexis.
On the other hand, Intel is ranked third, with a portfolio of 1,434 patents in advanced packaging.
LexisNexis PatentSight Managing Director Marco Richter praised TSMC, Samsung, and Intel for driving the field forward and setting the technology standard with their continuous investments in advanced packaging technology since 2015.
Advanced packaging plays a pivotal role in enhancing semiconductor designs, enabling the integration of numerous chips, or “chiplets,” either stacked or adjacent to one another, within the same container. This innovative approach has allowed chipmakers like Advanced Micro Devices (AMD) to gain a competitive advantage over rivals such as Intel.
In December 2022, Samsung Electronics established a dedicated team solely focused on advancing packaging technology, further solidifying its commitment to this crucial field, according to Moonsoo Kang, the unit’s chief.
Intel has refuted the notion that the size of TSMC’s patent portfolio indicates a more advanced technology. Benjamin Ostapuk, Intel’s vice president of intellectual property legal group, stated that their patents serve to protect their intellectual property rights, and the company’s patent investments are made with careful consideration.
As advanced chip packaging becomes increasingly vital to keep pace with the growing complexity of semiconductor designs, companies like TSMC, Samsung, and Intel are expected to continue investing in this technology to stay ahead in the competitive global chip manufacturing landscape.