Rockchip unveils next generation RK30xx platform

Telecom Lead:
a Chinese fabless semiconductor company and mobile Internet System-on-Chip
(SoC) solution provider, has launched its next generation RK30xx platform.

The new platform targets the mass market, cost-effective
Android tablets.

The platform is based on wide range of
ARM Intellectual Property that Rockchip has licensed, including dual-core
ARM Cortex-A9 MPCore processors, ARM quad-core Mali-400 MP Graphics
Processing Units (GPUs) and an ARM Artisan Physical IP Process Optimization
Pack (POP) for the Cortex-A9 processor.

The company said that the solution is ideal for customers
to quickly adopt for their Android-based tablet devices. The combination
of the ARM Cortex-A9 processor and the POP has enabled the highest performance
with the lowest power in the fastest time possible.

The RK30xx platform is a turnkey solution that reduces
design complexity and enables faster time-to-market for Android tablet
manufacturers, enabling them to address the fast changing consumer demands.

The tablet market is growing rapidly, and putting
greater demands on semiconductor companies to deliver cost-effective solutions
that can sustain an ever-increasing level of graphics, video and gaming
performance, while still being energy-efficient,” said Feng Chen, chief
marketing officer, Rockchip.

ARM is committed to providing advanced processor,
GPU and physical IP technologies to our Partners. This enables them to innovate
for complex, smart system applications, such as mobile Internet,” said Mike
Inglis, executive vice president and general manager, processor division, ARM.

The Rockchip RK30xx platform features a dual-core ARM
Cortex-A9 processor with up to 1.4GHz speed, implemented with Artisan
Processor Optimization Pack (POP).

It is based upon a Quad-core ARM Mali-400 MP GPU,
supporting OpenGL ES 1.1/2.0 and OpenVG 1.1.

The platform features 1080P multi-format video
decoder and 1080P video encoding for H.264 and vp8.

Furthermore, it has an embedded HDMI 1.4a, supporting 3D
display along with embedded 60bit/s ECC, supporting MLC NAND, E-MMC, i-NAND and

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