MediaTek and TSMC Forge Ahead with Cutting-Edge Chip Development

In a groundbreaking announcement, MediaTek and TSMC have unveiled their latest achievement: MediaTek’s flagship Dimensity system-on-chip (SoC), manufactured using TSMC’s 3nm technology.
MediaTek and TSMC
This technological milestone signifies a deeper alliance between the two giants, leveraging their respective strengths in chip design and manufacturing to create top-tier SoCs that promise high performance and energy efficiency, thereby empowering a diverse range of global devices.

Joe Chen, President of MediaTek, expressed the company’s commitment to innovation, stating, “We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways. TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”

Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, emphasized the significance of their collaboration, remarking, “This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket. Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.”

TSMC’s 3nm process technology is heralded for its superior performance, power efficiency, and yield, offering notable improvements over the previous N5 process. Specifically, it boasts an impressive 18 percent speed enhancement at the same power level or a 32 percent reduction in power consumption at the same speed, in addition to approximately 60 percent higher logic density.

MediaTek’s Dimensity SoCs, built using this cutting-edge process technology, are strategically designed to meet the ever-increasing user demands for mobile computing, high-speed connectivity, artificial intelligence, and multimedia experiences. The first flagship chipset, produced using TSMC’s 3nm process, is expected to power smartphones, tablets, intelligent cars, and various other devices, with availability anticipated in the second half of 2024.

The partnership between MediaTek and TSMC continues to push the boundaries of semiconductor technology, promising to deliver remarkable advancements in the world of consumer electronics and beyond.