MediaTek has launched its Dimensity 6000 series chipset targeting 5G smartphone users in developing markets.
The Dimensity 6100+ system on a chip (SoC) delivers premium features at an accessible price point, the company said in a statement.
MediaTek said the first smartphones featuring the Dimensity 6100+ chipset will be available in the third quarter of 2023.
5G smartphones – powered by Dimensity 6000 chipset – will have features including exceptional power efficiency, vivid displays, high frame rates, artificial intelligence (AI)-powered camera technologies, low power consumption and Sub-6 5G connectivity.
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
The Dimensity 6100+ comes with an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation, significantly reducing power consumption contributed by MediaTek UltraSave 3.0+ technology.
Moreover, the chip features two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, offering notable enhancements, including support for AI-powered cameras, 10-bit displays, outstanding UX and GPU performance and rich peripheral features.