MWC 2014: Mediatek unveils 5-in-1 wireless chip

At the Mobile World Congress (MWC) 2014, Mediatek announced the MT6630, the world’s first five-in-one combo wireless system-on-a-chip (SOC) to support smartphones, tablets and other premium mobile devices.

The MT6630 is designed to reduce component count and eBOM while improving design for manufacturers by eliminating external low noise amplifiers (LNAs) and integrating the Wi-Fi 2.4 GHz and 5 GHz power amplifiers (PAs), Bluetooth PA, and transmit-receive (T/R) switch into a PCBA footprint less than 65 sq mm.

Announced at the MWC 2014, the MT6630 delivers concurrent operation of all 5 systems operating at maximum compute intensity with no degradation compared to single-system operation while offloading the mobile device CPU for design ease and extended battery life.

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MT6630 uses a configurable PA architecture to save current at commonly used power levels, including those used for Miracast Wi-Fi Direct services. The MT6630 implements co-existence techniques, including for LTE to deliver better throughputs. The MT6630 supports Wi-Fi diversity for premium smartphones and tablets to improve antenna angle sensitivity and handheld scenarios.

The small-footprint design is available in 5 x 5mm WLCSP (Wafer Level Chip Scale Package) or a 7 x 7mm QFN (Quad Flat No-Leads) and requires only 44 components, which is around half that of other integrated wireless solutions.

Mediatek’s MT6630 is sampling now and complements the recently announced MT6595 octa-core SOC with LTE for premium mobile devices.

The first commercially available devices to use the MT6630 are expected in the second half of 2014.

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