Broadcom announces a joint development agreement with Hyundai to power connected car
Telecom Lead America: Broadcom announced a joint development agreement with Hyundai Motor to power the connected car.
The collaboration will integrate infotainment, telematics and Advanced...
Ciena launches new software capabilities for packet networking portfolio
Telecom Lead America: Ciena has launched new software capabilities for its packet networking portfolio.
Indian telecom operators will benefit as the new software capabilities enable...
AVM taps Altair Semiconductor to power new LTE products
Telecom Lead America: Germany based AVM has selected Altair Semiconductor to power its new LTE 4G products.
The new products will support home networking and...
DSP Group and SoftAtHome integrate home security, control and automation solutions
Telecom Lead America: Chip major DSP Group and SoftAtHome have jointly integrated Digital Enhanced Cordless Technology (DECT) Ultra Low Energy (ULE) home security, control...
DSP Group signs Comigo to launch home automation solution
Telecom Lead America: DSP Group has signed up with Comigo to launch home automation (HA) solution based on DECT Ultra Low Energy (ULE) technology.
The...
Broadcom likely to lead Bluetooth IC market this year
Telecom Lead America: Broadcom is likely to lead the Bluetooth IC market (including stand alone and combo ICs) market this year.
Broadcom had over 40...
Intel yet to make impact in smartphone applications processor market, Qualcomm leads
Telecom Lead India: Intel could not make any impact in global smartphone applications processor market in the first half of 2012.
In H1 of 2012,...
AMD launches processors for tablet and small form factor PC market
Telecom Lead America: AMD has launched processors for tablet and small form factor PC market.
Intel is currently strengthening its presence in tablet market.
The first...
Intel unveils tablets and tablet convertible designs based on latest processors
Telecom Lead America: Chip major Intel Corporation and its OEM partners today unveiled the first wave of new tablets and tablet convertible designs based on Intel Core...
Qualcomm launches two new Snapdragon S4 mobile processors
Telecom Lead America: Chip major Qualcomm has launched two new Snapdragon S4 mobile processors.
Snapdragon S4 Play processors will offer OEMs both dual-core and quad-core CPUs...
ON Semiconductor launches new system-on-chip (SoC) solution for noise reduction
Telecom Lead America: ON Semiconductor has launched a new system-on-chip (SoC) solution that helps in noise reduction.
The new SoC solution provides wideband single- or...
Standards-based wireless connectivity chipset market to exceed $10 billion in 2012
Telecom Lead America: The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, says Peter Cooney, wireless connectivity...
Microsoft and RIM in pact to give access to exFAT for Blackberry devices
Telecom Lead U.S: Microsoft and RIM have formed an agreement that gives RIM broad access to the latest Extended File Allocation Table (exFAT) for...
Samsung starts production of advanced mobile DRAM chips for mobile devices
Telecom Lead Asia: Samsung Electronics has kicked off mass production of advanced mobile DRAM (dynamic random access memory) chip.
The 2GB, low power double-data-rate 3...
Intel CTO shares new technologies for demanding telecom world
Telecom Lead America: Intel Chief Technology Officer Justin Rattner has demonstrated a working all-digital WiFi radio at the Intel Developer Forum.
“In the future, if...
Vitesse Semiconductor to expand in India to tap mobile broadband market
Telecom Lead India: Vitesse Semiconductor, a provider of IC solutions for Carrier and Enterprise networks, is expanding in india.
WPI Group, a subsidiary of WPG...
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