Chip vendor Qualcomm on Wednesday said it expects the commercial availability of devices in the first half of 2014 with its new Snapdragon 805 processors that will assist smartphone makers to offer better mobile video, imaging and graphics experiences at Ultra HD (4K) resolution.
Qualcomm, which is now sampling Snapdragon 805 processor, claims that the new Snapdragon 805 processor features the new Adreno 420 GPU, with up to 40 percent more graphics processing power than its predecessor.
The Snapdragon 805 processor is the first mobile processor to offer system-level Ultra HD support, 4K video capture and playback and enhanced dual camera Image Signal Processors (ISPs), said Qualcomm in a statement.
Qualcomm said Krait 450 quad-core CPU is the first mobile CPU to run at speeds of up to 2.5 GHz per core, while offering memory bandwidth support of up to 25.6 GB/second.
Gobi MDM9x25 chipset supports LTE carrier aggregation and LTE Category 4 with superior peak data rates of up to 150Mbps.
Qualcomm’s Wi-Fi for mobile, 2-stream dual-band QualcommVIVE 802.11ac, enables wireless 4K video streaming and other media-intensive applications. With a low-power PCIe interface to the QCA6174, tablets and smartphones can take advantage of faster mobile Wi-Fi performance (over 600 Mbps), extended operating range and concurrent Bluetooth connections, with minimal impact on battery life. The chip vendor did not specifically mention about the benefit to battery.
The Snapdragon 805 processor supports Hollywood Quality Video (HQV) for video post processing, first to introduce hardware 4K HEVC (H.265) decode for mobile for extremely low-power HD video playback.
Meanwhile, Qualcomm introduced its fourth-generation 3G/LTE multimode solutions with the newest modem chipset, the Qualcomm Gobi 9×35, and RF transceiver chip, the Qualcomm WTR3925, designed for 4G LTE Advanced mobile broadband connectivity.
Qualcomm Gobi 9×35 and WTR3925 will begin sampling to customers early next year.
The Qualcomm Gobi 9×35 is the first announced cellular modem based on the 20 nm technology node with support for global carrier aggregation deployments up to 40 MHz for both LTE TDD and FDD Category 6 with download speeds of up to 300 Mbps.
The Gobi 9×35 and WTR3925 are designed to use less power and occupy less printed circuit board area and continue the trend towards tighter integration, smaller size and increased performance.
The 40 MHz carrier aggregation capability of the Gobi 9×35, coupled with the comprehensive carrier aggregation band support of the WTR3925, is engineered to allow network operators to combine their fragmented spectrum in all possible 3GPP-approved combinations of 5 MHz, 10 MHz, 15 MHz, and 20 MHz bandwidths to increase capacity and service more subscribers with an improved end-user experience.
For OEMs, the combination of the Gobi 9×35 modem and WTR3925 chipset enables a powerful, single platform that can be used to launch LTE Advanced devices faster at a global scale. Together, these solutions are designed to deliver up to 2X faster LTE Advanced, CAT 6 up to 300 Mbps, along with dual carrier HSUPA and dual band multi-carrier HSPA+.