Telecom Lead America: Qualcomm Technologies has launched Qualcomm RF360 Front End Solution that enables a single, global 4G LTE design for mobile devices.
The comprehensive, system-level solution addresses cellular radio frequency band fragmentation.
The Qualcomm RF360 solution is designed to reduce power consumption and improve radio performance while reducing the RF front end footprint inside of a smartphone by up to 50 percent compared to the current generation of devices.
Additionally, the solution reduces design complexity and development costs, allowing OEM customers to develop new multiband, multimode LTE products faster and more efficiently.
Envelope Power Tracker (QFE11xx) chip is designed to reduce overall thermal footprint and RF power consumption by up to 30 percent, depending on the mode of operation.
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Qualcomm’s RF front end solution comprises chips designed to improve RF performance and help OEMs easily develop multiband, multimode mobile devices supporting seven cellular modes — LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM/EDGE.
Moreover, the RF front end solution includes envelope power tracker for 3G/4G LTE mobile devices, an antenna matching tuner, an integrated power amplifier-antenna switch, and a 3D-RF packaging solution incorporating key front end components.
OEM products featuring Qualcomm RF360 Solution are anticipated to be launched in the second half of 2013.
Qualcomm also launched a new RF transceiver chip. The WTR1625L can accommodate all cellular modes and 2G, 3G and 4G/LTE frequency bands and band combinations that are either deployed or in commercial planning globally.