Agilent to showcase manufacturing test solutions for LTE-Advanced, LTE and HSPA+

By Telecom Lead Team : Agilent Technologies will
showcase its test and measurement solutions for LTE-Advanced, LTE, HSPA+,
dual-carrier HSDPA, MIMO, multi-standard radio and voice over LTE, along with
2G/3G solutions for R&D, manufacturing and deployment at the Mobile
World Congress in Barcelona 2012.

 

We strive to anticipate our customers’ needs with
first-to-market test solutions such as TD-LTE beamforming MIMO, 42-Mbps
throughput test, multi-standard radio and high-throughput manufacturing test.
We are dedicated to helping them achieve a competitive advantage in their
mobile communications R&D, manufacturing and deployment environments,” said
Guy Séné, president of Agilent’s Electronic Measurement Group.

 

At the Mobile World Congress, Agilent will demonstrate
how to perform RF and parametric tests to the latest standards for LTE and
LTE-Advanced using Agilent LTE & LTE-Advanced signal-generation and
analysis tools such as 89600 VSA software, X-Series signal
analyzers including the N9030A PXA and the N9020A
MXA, SystemVue and Signal Studio software.

 

The demonstrations will look at up to eight
measurement channels for TD-LTE base-station RF antenna beamforming with
the N7109Amultichannel signal analyzer.


It will address the challenges of multi-standard radio
per 3GPP Release 9 with the N9083A MSR X-Series measurementapplication operating
on Agilent X-Series signal analyzers, including the N9030A PXA and the
N9020A MXA.


Agilent will test 42-Mbps DC-HSDPA IP data
throughput using the new E5515E platform for the 8960 wireless
communications test set.


The solutions is capable of transforming the
manufacturing test environment to get new wireless devices to market faster
while reducing cost of test with Agilent’s new EXT wireless communications
test set. 

 

The EXT architecture, a part of Agilent’s X-Series signal
analyzers, features an advanced sequence analyzer optimized for high throughput
non-signaling test techniques for 2G/3G/LTE and future wireless devices. A
comprehensive suite of supporting software tools, including Sequence
Studio, enhanced Signal Studio, chipset control, calibration and test software
helps accelerate time-to-volume manufacturing.

 

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