Icom license CEVA DSP for wireless baseband spplications

By Telecom
Lead Team:
CEVA, a licensor of silicon intellectual property (SIP) platform
solutions and DSP cores, announced that Icom has licensed CEVA DSP core
technology to power its digital wireless communication products.


The company
claims that its flexible DSP engine enabled Icom to develop a cost-efficient,
programmable wireless baseband solution with ultra-low power consumption for
their latest range of land mobile products.


“We chose
CEVA’s DSP for our wireless communication products, due to their proven track
record and industry leadership in baseband DSPs. The low-power nature of our
communication products requires the most power efficient DSP for the task.
CEVA’s DSP delivers outstanding power efficiency, while maintaining exceptional
performance standards,” said a spokesperson at Icom.


The company
claims that its DSP cores power many of the world’s wireless semiconductors,
enabling unrivalled power consumption, performance and cost efficiencies in
wireless solutions.


optimal balance of power and performance delivered by our DSP is ideal for
Icom’s evolving product lines as they enhance wireless baseband functionality.
The addition of Icom to the broad range of customers leveraging our DSPs for
wireless baseband applications is further evidence of our dominant industry
position in licensable DSPs,” said Eran Briman, vice president of
marketing at


The company
added that CEVA has more than 35 wireless design wins to date including over 15
design wins for LTE, targeting a wide range of handset, mobile broadband and
wireless infrastructure applications.


The company’s
wireless customer base includes, Broadcom, Intel, Mindspeed, Nufront, Samsung,
Spreadtrum, ST-Ericsson, VIA Telecom, Xincomm and now Icom.


In total, more
than 2 billion CEVA-powered wireless handsets have shipped.


has also announced that it will demonstrate its leadership in mobile DSP
technology for advanced communications and multimedia applications at Mobile
World Congress 2012.


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