MWC 2024: HFCL Showcases 5G FWA Indoor CPE powered MediaTek

HFCL has showcased its 5G Fixed Wireless Access Indoor CPE powered by chipset major MediaTek at the Mobile World Congress (MWC 2024).
HFCL 5G Fixed Wireless Access Products at MWC 2024MediaTek is supplying its T750 chipset to power HFCL’s 5G FWA Indoor CPE. HFCL’s 5G FWA Indoor CPE has ultra-compact form factor and minimal power consumption, thanks to MediaTek chipset. MediaTek T750, a 7nm compact chipset, comes with a 5G radio and quad-core Arm CPU, ensuring connectivity across multiple devices with dual-band 4×4 Wi-Fi 6 support.

HFCL’s 5G FWA Indoor CPE is featuring a 2.5 Gbps Ethernet interface for high-speed data transfer. HFCL 5G FWA Indoor CPE is a plug-and-play device that includes an AI-integrated mobile app, enabling user-friendly self-installation and helping identify the best signal location.

Evan Su, General Manager, Wireless Communications, MediaTek said, “HFCL’s ‘made-in-India’ 5G FWA Indoor CPE powered by the MediaTek T750 chip will help customers experience 5G FWA connectivity globally.”

The 5G FWA Indoor CPE supports both Standalone (SA) and Non-standalone (NSA) technologies across diverse frequency bands, providing uninterrupted connectivity with fiber-like speeds wirelessly. These CPEs deliver fiber-like high-speed connectivity through robust 5G networks, addressing obstacles associated with fiber deployments.

Mahendra Nahata, Managing Director, HFCL said: “HFCL 5G FWA Indoor CPE helps telecom operators address the last-mile connectivity challenges in an ultra-compact form factor and provides a fiber-like experience to both consumers and enterprises.”

The 5G last-mile equipment market is projected to reach USD 68 billion by 2030 at a CAGR of 48.3 percent, according to a recent report from the Future Market Insights.

MediaTek T750 is an integrated 5G modem with a Quad-core CPU Platform for Fixed Wireless Access and Mobile Hotspot CPE Devices. For telecom operators, the T750 provides 5G speeds up to 4.7Gbps, exceeding fixed line services, utilizing existing cellular infrastructure and avoiding the costs of laying down cables or fiber.

For ODMs and OEMs, the MediaTek T750 reduces development times and costs, providing significant time-to-market advantages.