Telecom Lead America: Qualcomm announced that vendors
have released more than 100 cellular and connectivity solutions for Internet of
Everything (IoE)/M2M ecosystem based on Qualcomm chipsets.
These third party solutions are available on
M2MSearch.com, Qualcomm’s new online database for cellular and connectivity
modules.
Qualcomm’s IoE roadmap includes 1X, EV-DO, HSPA and LTE
cellular chipsets, featuring Gobi modem technology.
These chipsets target M2M applications with integrated
application processing and mobile broadband capabilities, such as automotive
infotainment and digital signage.
The Qualcomm MDM6600 (HSPA/EVDO Rev. B) and MDM6200
(HSPA) chipsets are ideal solutions for applications such as telematics that
require cross-regional connectivity.
Entry-level M2M applications, such as smart metering,
home security and industrial automation can utilize the QSC6270 (HSDPA) and
QSC1105 (1X/GPRS) chipsets for cost effective integration of cellular
capabilities.
Connectivity chips from Qualcomm Atheros are included in
Qualcomm’s IoE roadmap. Wireless LAN connectivity is enabled by the Qualcomm
Atheros AR4100 and AR4100P, single-chip, single-stream 802.11n Wi-Fi
system-in-package solutions with an integrated networking stack.
The Qualcomm Atheros QCA7000 chip enables smart energy
and automation applications, with the industry-first M2M HomePlug Green PHY
powerline communications solution that is low energy and cost effective while providing
for easy integration into customer designs.
Qualcomm’s M2MSearch.com helps developers in selecting
the cellular and connectivity hardware for their M2M devices. The website
includes reference to more than 100 modules and gateways with embedded Qualcomm
and Qualcomm Atheros chipsets.
“Qualcomm will continue to support the emerging
‘Internet of Everything’ with chipsets and solutions that satisfy the needs of
verticals, module and device OEMs and wireless operators,” said
Kanwalinder Singh, senior vice president of business development, Qualcomm.
