Teradyne provides UltraFLEX Test System to RDA Microelectronics for RF Test

Telecom Lead Asia: RDA Microelectronics, a fabless
semiconductor company, has selected Teradyne, a supplier of automatic test
equipment to test mobile SOC devices using Teradyne’s UltraFLEX-HD test system,
along with the UltraPAC80, UltraPin1600, UltraWave 12G and UltraVI80
instruments, based on performance, time-to-market and cost-of-test.


“We selected the UltraFLEX to test our
high-performance RF SOC devices. This equipment produces the best yields
possible for critical tests and allows us to guarantee our product quality.
Additionally, the throughput and parallel test efficiency of the UltraFLEX
allows us to meet our aggressive product test cost objectives,” said Zhao
GuoGuang, vice president of Operations at RDA Microelectronics.


The UltraFLEX offers a range of coverage when
the device mix and throughput goals demand the highest speed, precision,
coverage and capacity for superior multisite test efficiency. It achieves lower
cost of test through faster test times and higher parallel efficiency. And the
UltraFLEX-HD does it all in a compact 2m x 2m footprint.


RDA is one of China’s leading mobile IC providers, and
we are very pleased with its selection of the UltraFLEX, the ideal
production solution for complex, leading-edge SOC devices,” said Gregory
Smith, computing and communications business unit manager of Teradyne.


Last year, Teradyne launched MPAC (Magnum
Precision Analog Channel) instrument for the Magnum family of test systems to
enable massively parallel test of consumer digital semiconductor devices
containing analog peripherals.


[email protected]