Broadcom launches new chipset targeting G.fast market

Broadcom on Tuesday announced the launch of a new chipset targeting the G.fast solution market.

The new chipset will enable global telecom operators to deliver Gigabit performance over currently installed twisted pair copper cabling, said Broadcom.

The BCM65200 DSP and BCM65900 analog front end family of chipsets — built on Broadcom’s central-office DSL technology — are the industry’s highest density G.fast solution.

The BCM65200 DSP and BCM65900 analog front-end VDSL chipset with on-chip vectoring and integrated G.fast support a new DSP architecture to deliver integration.

Broadcom in a statement said that the power efficient BCM65200/900 family incorporates up to 36 lines of VDSL2 or six lines of G.fast, plus vector interfaces that eliminate the need for external PHY and framing devices.

Broadcom

This will be the most power-efficient system solution for high-density G.vector DSLAMs as well as new G.fast-based fiber-to-the-distribution point (FTTdp) architectures, said Broadcom.

The new chipset ensures backward-compatibility to existing VDSL and ADSL technologies, including simultaneous G.Fast and G.vector crosstalk cancellation.

The BCM65200/900 family enables telecom operators to selectively deploy G.fast to new customers in the same system as VDSL2, preventing the forklift upgrade required for alternative solutions.

Oliver Lamparter, Swisscom Innovation Product Manager, said: “We will continue to work together to address challenges and unlock the dramatic potential of evolving copper access technologies. As we consider high-density deployments, Swisscom will look to leverage Broadcom’s new end-to-end G.fast solution in our near-term G.fast offerings.”

As operators in Europe and beyond expand both vectoring and G.fast, Infonetics expects that 63 percent of the of the cumulative 179 million VDSL ports shipped globally from 2014 to 2018 will be vectoring-capable.

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