Broadcom clocks 14.3% increase in Q4 revenue to $2.08 billion
Telecom Lead America: Broadcom has clocked 14.3 percent increase in fourth quarter revenue to $2.08 billion from $1.82 billion in Q4 2011.
Net income for...
MediaTek’s GNSS receiver SoC solutions support Beidou satellite system
Telecom Lead Asia: MediaTek has announced its 5-in-1 multi-GNSS (Global Navigation Satellite System) receiver SoC solutions support the Beidou Satellite Navigation System.
The Beidou system...
Psion helps Motorola Solutions report 6% revenue increase to $2.44 billion in Q4 2012
Telecom Lead America: Motorola Solutions’ Q4 2012 revenue increased 6 percent to $2.44 billion.
The communications gear maker’s quarterly profit rose 89 percent, boosted by...
Samsung overtakes Apple as top semiconductor customer in 2012
Telecom Lead Asia: Samsung has overtaken Apple as the top semiconductor customer in 2012.
Gartner says based on analysis of the design total available market...
Texas Instruments launches Center of Excellence at Netaji Subash Institute of Technology
Telecom Lead Asia: Texas Instruments (TI) has launched a Center of Excellence at Netaji Subash Institute of Technology (NSIT), Delhi.
This is the first Center...
Will Intel gain from new Atom processor platform for low-end smartphones?
Telecom Lead Asia: Intel’s new Atom processor platform for low-end smartphones in emerging mobile markets could allow the chip major to expand its currently...
Apple leads tablet applications processor market with 53% revenue share in Q3 2012
Telecom Lead India: Apple is leading the tablet applications processor market with 53 percent revenue share in Q3 2012.
NVIDIA, Texas Instruments, Qualcomm and Samsung...
Qualcomm leads smartphone applications processor market with 42% revenue share in Q3 2012
Telecom Lead India: Wireless chip provider Qualcomm is leading smartphone applications processor market with 42 percent revenue share in Q3 2012.
Qualcomm’s emerging rival MediaTek’s...
CES 2013: Telit unveils UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on...
Telecom Lead America: Telit Wireless Solutions, a provider of M2M modules and value-added services, has unveiled the UE910 V2 HSDPA and HE910 V2 HSPA+...
CES 2013: MediaTek launches dual-SIM plus 1 micro SD card capable NFC solution
Telecom Lead America: MediaTek has launched MT6605, a dual-SIM plus 1 micro SD card capable Near Field Communications (NFC) solution.
MediaTek’s MT6605 NFC chip is...
CES 2013: Audi unveils Audi A3 with 4G / LTE wireless connectivity powered by...
Telecom Lead America: Audi has unveiled the 2013 Audi A3 with 4GLTE wireless connectivity powered by Gobi multi-mode 3G/4G LTE chipset by Qualcomm Technologies.
The...
CES 2013: Qualcomm and Sesame Workshop to collaborate for mobile learning applications
Telecom Lead Asia: Chip major Qualcomm and Sesame Workshop, a nonprofit educational organization, will collaborate for mobile learning applications aimed at childhood education.
As part...
Hans Rijns and Dave French to head R&D at NXP Semiconductors
Telecom Lead Europe: Hans Rijns and Dave French will be heading R&D at NXP Semiconductors.
Hans Rijns will have the responsibility as chief technology officer....
Samsung expands R&D facilities in U.S. with a 1.1 million square foot facility
Telecom Lead India: Samsung is expanding R&D facilities and innovation centers in the U.S. with a 1.1 million square foot facility.
Samsung Semiconductor is planning...
Broadcom to lead wireless connectivity chips market that will cross 5 billion in 2013
Telecom Lead Asia: Broadcom will lead the wireless connectivity chips market that will cross 5 billion in 2013.
Broadcom will benefit largely from the fast...
Qualcomm Atheros launches low power NFC solution with 50% smaller footprint
Telecom Lead America: Qualcomm Atheros has launched a low power near field communication (NFC) solution that will enable mobile devices with contactless communications and...
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