Telecom Lead America: Texas Instruments announced that its Bluetooth v4.0-based CC2560 and CC2564 wireless devices are available in QFN packages offered by TI and its partners.
TI also launched additional production-ready modules based on the two devices, as well as software and tools. The QFN packages and various modules give customers choice regarding power, size and cost requirements.
The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available through TI and its distributors.
TI encourages customers to download from its wiki a two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications.
TI will release full-featured evaluation boards and design materials for hardware and software prototyping with the CC2560 and CC2564 QFN devices later this quarter.
In addition to the two modules previously announced, four new complete, validated and certified modules are now available from TI partners. The modules vary in size, temperature range and output power—including Class 1 and Class 2 versions. One module also offers a pre-integrated MCU plus CC2564 solution for faster development.
Software development kits for Bluetooth and Bluetooth/Bluetooth low energy solutions are currently available. Customers can also access sample applications and demos provided in source code showing API usage.
A royalty-free Bluetooth stack and various profiles are provided pre-integrated on MCUs such as TI’s MSP430 MCU and Stellaris ARM Cortex-M3/M4 MCUs.
TI will also release an updated Bluetooth stack in mid-4Q 2012. The new stack will offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimization and the ability to support a broader range of MCUs.