TE Connectivity in pact with Texas Instruments for high density RF module

By Telecom Lead Team: TE Connectivity has teamed up with
Texas Instruments to introduce a new high density module (HDM) for its FlexWave
Prism distributed antenna system (DAS).

 

The new high density module (HDM) doubles the number of
frequencies a FlexWave Prism DAS can support or doubles its output power.

 

TE is now able to address mobile operators’ growing need
to add spectrum and upgrade MIMO solutions at antenna sites by using the new
HDM.

 

The HDM portfolio addresses the need to add spectrum such
as 700 and AWS inclusive of MIMO support within a single enclosure or double
the output power to support growing needs for capacity in the network.

 

The new HDM enables the FlexWave Prism DAS to offer
greater density and capacity than other DAS or Radio Head solutions, and to
offer more flexibility to service providers seeking more efficiency in
delivering wireless coverage and capacity.

 

TI’s GC5337 DPD is designed to extend the reach or
capacity of Radio Access Network equipment, and this application is an excellent
example of how it can be used to improve RAN functionality,” said David
Brubaker, product line manager, digital radio, Texas Instruments.

 

HDM modules of various frequency bands will be released
throughout the next year. The initial release is the 850 single High-Power HDM
followed by the 700 MHz Dual HDM (MIMO).

 

The high density module further extends the reach,
performance, and flexibility of our FlexWave Prism DAS product,” said Chris Jurasek,
vice president and general manager, Wireless and Services at TE.

 

Recently, TE Connectivity introduced a new video distribution system (VDS) that enables
network managers to deliver HD RF and IP video over an existing data cabling
infrastructure without the need for coaxial cabling or any RF tuning.

 

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