Telecom Lead India: MediaTek, a fabless semiconductor company for wireless communications and digital multimedia solutions, announced the launch of “Cool 3D”, the world’s most complete 3D suite of solutions, for its smartphone platforms.
The “Cool 3D” suite for MediaTek smartphone platforms includes support for stereo 3D cameras and displays, real-time 2D-to-3D conversion and an optimal 3D user interface that is designed to provide consumers with a stunning 3D experience.
The technology comes with two key features: “3D Cool Shot” and “3D Cool Show”. MediaTek’s “3D Cool Shot” solution supports a cost-effective 5 MP, dual-lens camera, which achieves 1080P, 24 FPS 3D images, giving users a high-definition visual experience
The system integrates the functionality of the dual-lens bridge devices into the main smartphone platform, reducing system cost and saving precious board area. It substantially improves the stereo 3D effect with anti-fatigue capabilities, and real-time transformation between 2D/3D modes, allowing for convenient switching between the 2D and 3D displays.
Two distinguishing features are “3D Cool Shot” and “3D Cool Show”. MediaTek’s “3D Cool Shot” solution supports a cost-effective 5 MP, dual-lens camera, which achieves 1080P, 24 FPS 3D images, giving users a high-definition visual experience
Cool 3D solutions, which leverage MediaTek’s established 3D technologies from the DTV and Digital Home markets, are aimed at creating an optimal stereo 3D display with a custom-tailored 3D interface.
Global Industry Analysts has predicted that global market for 3D enabled smartphones will register 994 million units in annual shipments by the year 2018. The demand for this innovation is driven by increased availability of 3D content, such as games, videos and full length movies.
“One consequence of the rapid developments in the smartphone market is product homogenization or the ‘all smartphones look alike’ phenomena. Creating product differentiation has become one of the biggest challenges for the mobile phone industry,” said Ching-Jiang Hsieh, president of MediaTek.
“From Dual-SIM to 3D capabilities, MediaTek has always pushed technological innovation in our platforms, enabling rich and compelling devices and solutions,” Hsieh said. “By working together with our customers, we hope our industry-leading, ”Cool 3D” suite of solutions can lead the wave of 3D smartphone popularity, allowing even more consumers to enjoy an extraordinary 3D experience.”
